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“solder bumping”
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imi-corp.com
International Micro Industries, Inc
International Micro Industries (IMI) offers state of the art Wafer Bumping and Wafer Level Packaging WLP contract services via high aspect ratio, high precision electroplating and photolithography technology. IMI offers complete solutions; wafers from re
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flipchip.com
FlipChip International
About Us Company Mission Statement ?Quality and Registrations? Licensing Rosestreet Labs Services Design Bump Probe Die Sales Analytic Bumping Design Options Non-Solder Bumped Options Electroplated Cu EDC?(various offerings) EliteUBM? -Electroless Ni/AU